- Four 6" rotating substrate holders
- Dual-chamber with independently cryopumped load lock
- Base pressure 2x10-7 torr, sputtering pressure controlled using gas flow combined with a foreline butterfly valve.
- Six cathodes configured for variations of sequential or simultaneous sputtering or reactive sputtering configurable with any of the fitted power supplies.
- Precious Metals: Pt, Au, Ir
- Adhesion Layers: Ti, Cr, TiW