Deposition

ALD

Evaporation

MOCVD

Parylene

PECVD

Sputter

  • Denton 635
    • Automated sputter deposition of metals, alloys, and insulating thin films
      • Four confocal cathodes
      • Std targets 4" Au, 4" Cr, 3" Al, 3" Ti
  • Denton Discovery 18
    • Sputter deposition of metals, alloys, and insulating thin films (user configurable)
    • Film thicknesses controllable from a few nm to hundreds of nm
    • Three 3" diameter confocal cathodes
    • 2 RF power supplies
    • Switchable DC power supply
    • Co sputter capable
    • Reactive sputtering available (Nitrogen or Oxygen)
    • 6" Diameter stage
    • Substrate rotation
    • +/- 10% Uniformity
    • Cryo and turbo pumped to 1 x 107 Torr
    • Substrate heat up to 200 C
    • Liftoff deposition with sputter power
    • Argon pressure range 2-50 mT controllable with 200 sccm MFC controller (no APC valve)
  • TMV Super

    SS-40C-IV Multi Cathode Sputtering system

    • Precious Metals: Pt, Au, Ir
    • Adhesion Layers: Ti, Cr, TiW

Targets

Evaporation Materials Available:

  • Al, Ag, Au, Au/Ge, Cr, Cu, Ge, In, Mo, NiCr, Nb, Ni, Ta, Ti, W

Chemical Vapor Deposition