Packaging

Dicing

• Disco DAD641 Programmable silicon dicing saw (Disco)

• Disco DAD3220

• UV Tape Release UVM-102W

Wafer Bonding

• EVG 520 IS

Wirebonding

• MEI Wedge

Laser Ablation

• Optec Micromaster KrF micromachining system (KrF excimer laser)

• LaserStar 1900

• DPSS UV Laser Marker

CMP

• Strasbaugh 6EC