- Sputter deposition of metals, alloys, and insulating thin films (user configurable)
- Film thicknesses controllable from a few nm to hundreds of nm
- Three 3" diameter confocal cathodes
- 2 RF power supplies
- Switchable DC power supply
- Co sputter capable
- Reactive sputtering available (Nitrogen or Oxygen)
- 6" Diameter stage
- Substrate rotation
- +/- 10% Uniformity
- Cryo and turbo pumped to 1 x 107 Torr
- Substrate heat up to 200 C
- Liftoff deposition with sputter power
- Argon pressure range 2-50 mT controllable with 200 sccm MFC controller (no APC valve)
- S/N 18003
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Targets Available
Metals/Alloys:
Ag, Al, Al/Si, Au, C, Chromel, Co, Cr, Cu, Cu/Ag, Ge
Ir, Fe, Ni, NiCr, NiCrFe, Nb, Pd, Pt, Si (p-type), Ta, Ti, TiW, V, W
Oxides / Ceramics:
Al2O3, SiO2 ITO, BN, CeSm(ox), LaSrFe(ox), NaMnO3, NdMgO, SiC, Si3N4, TaO2, TiO2,
YNiZrO,YSZ, ZnO
Trainig Video https://www.youtube.com/watch?v=-kzvwDqwa9c&feature=youtu.be
Process Information
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