Heidelberg DWL66+

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DWL 66+ System Specifications


  • High Resolution write head: 300nm
  • 5mm write head: 800nm
Write Time for 100mm wafer or photomask
  • Hi Resolution: 2 days
  • 5mm write head: 4 hours
Grayscale direct writing
Substrates up to 200mm wafer diameters and 9"x9" photomasks
Pneumatic and optical autofocus (OAF works only with reflective substrates, transparent substrates only work with pneumatic)
300nm lithography dwl66

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