Heidelberg DWL66+

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DWL 66+ System Specifications

Resolution

  • High Resolution write head: 300nm
  • 5mm write head: 800nm
Write Time for 100mm wafer or photomask
  • Hi Resolution: 2 days
  • 5mm write head: 4 hours
Grayscale direct writing
Substrates up to 200mm wafer diameters and 9"x9" photomasks
Pneumatic and optical autofocus (OAF works only with reflective substrates, transparent substrates only work with pneumatic)
 
DWL66+
 
300nm lithography dwl66
 
 

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