S/N: HI-798
Live Screenshot: Click Here
Process
Meet to discuss fab process steps ~hour |
Researcher design CAD layout ~Weeks |
Staff inspect CAD layout ~30 min |
Translate file to GDS II ~30 min |
Inspect finished mask ~10 min |
Etch Chrome on Mask ~5 min |
Develop Photoresist on mask ~5 min |
Write mask on μP |
Applications
Photomask production
- Vast Majority of uses -5" Cr on glass
Grayscale 3D writing
-One research group -Optical applications Direct patterning on wafers
-Occasional use by multiple research groups -Smallest & sharpest feature size in practice (~0.8 um) -Alignment to pre-existing features possible |