MEI Wedge

Status Problem

  • Designed for:
    • Ultrasonic wedge bonding
    • Thermosonic wedge bonding
    • Thermocompression wedge bonding
  • Of:
    • IC's
    • Hybrids
    • Microwave devices
    • Laser diodes
  • Using gold or aluminum wire from .5 mil (12.5 microns) to 3 mil (76 microns) and ribbon.

 

Manufacturer Information:

Mech-El website

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