Tool Owner
Please contact
Joe Jacob for more information. (S/N 721002)
Etching
- Etch Gases: SF6, CF4, O2, Ar, N2, CHF3, C4F8
- Cryo DRIE up to 5 um/min
- 4" Wafers, 6" or 8" wafers with clamp change
Images
High Aspect Ratio:
Minimal Undercut:
Process Status
Live Screenshot: Click Here
Or live screenshots for other tools: Click Here
Process Information
Oxford 100 DRIE SF6/C4F8 Log Sheet
Cross Section Pictures of Results: High Aspect Ratio No Undercut
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