S/N: 06060026
- Top and Bottom Side alignment
- One can expose in all common printing modes using collimated light optics
- Can be used in all major lithography areas:
- M(O)EMS
- Bulk MEMS
- Optoelectronics with more coarse features
- Power devices
- Bumping
- Etc.
- Equipped with a programmable control unit
- Alignment is carried out by means of micro-meter screws
- Fitted with a calotte chuck wedge error compensation system
- Top side alignment
- Equipped with a splitfield microscope
- CCD and monitor
- Supports 5" and 7" masks
Standard Process Measurements
Meausured linewidths (Shipley 1813, 2000 rpm 60 sec spin, 110 C 60 sec hotplate bake, 30 mJ/cm2 exposure dose, AZ 1:1 35 sec)
Minimum measured linewitdth at full photoresist height: 2 um
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