TMV Super

Status Problem

TMV Super

  • Four 6" rotating substrate holders
  • Dual-chamber with independently cryopumped load lock
  • Base pressure 2x10-7 torr, sputtering pressure controlled using gas flow combined with a foreline butterfly valve.
  • Six cathodes configured for variations of sequential or simultaneous sputtering or reactive sputtering configurable with any of the fitted power supplies.
    • Precious Metals: Pt, Au, Ir
    • Adhesion Layers: Ti, Cr, TiW

S/N: 1N15840103

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