Denton 635
- Automated sputter deposition of metals, alloys, and insulating thin films
- Four confocal cathodes, inclined 25 degrees off vertical
- Std targets 4" Au, 4" Cr, 3" Al, 3" Ti
- Other targets by arrangement with staff
- Film thicknesses controllable from a few nm to hundreds of nm
- Sputter power supplies, DC1 pulse or DC, DC2, RF1
- Switch-control any supply to any cathode
- Co sputter capable
- Substrate sputter pre-clean with RF2 supply
- PEM controllable reactive sputtering (Nitrogen or Oxygen)
- 8" Diameter stage
- Substrate rotation
- +/- 5% Uniformity
- Cryo pumped to 5 x 10^-8 Torr
- Substrate heat up to 500 C (heated stage installed)
- Liftoff deposition with water-cooled stage (std configuration)
- Argon pressure range < 1-90 mT controllable with APC and 100 sccm MFC controller
Equipment Monitor
S/N: 69469
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